The chipmakers are coming out swinging this week at Mobile World Congress 2012, and as Qualcomm is proving today, they’re all going to bring us undeniably excellent devices throughout 2012 and beyond. Speaking on both the Snapdragon S4 processor and the Gobi modem, Qualcomm spoke this week on how their set of chips is able to out-do the competition with an integrated experience. Rob Chandhok, Senior Vice President and President of Qualcomm Internet Services and President of Qualcomm Innovation Center, Inc., as well as Serge Willenegger, Vice President of Technology spoke about both the upcoming S4 platform and Gobi’s 5th generation in kind.
Stating with information on Superior Microarchitecture for thermal and power efficiency, we’re reminded instantly of Texas Instruments outline of OMAP 5 with their “Thermal Budget”, heat being the key in both cases. This is a good sign for every user as now that this heat factor is being pushed by several chipset makers as a big issue, our handsets will be cooler very, very soon. The as well, of coursebe keeping it cool at the same time as being able to take on a wide variety of devices across the planet as well, of course. Head to the Q and A section of this post for more information on the S4 – there’s also the next generation Gobi modem from Qualcomm getting prepared for the future as well for LTE superiority.